Hanmi Semiconductor is showcasing a range of 2.5D packaging equipment for AI system semiconductors and TC bonders for HBM at ...

The news is coming from TheElec, with their sources saying Samsung's Advanced Package (AVP) team will be providing an interposer and I-Cube -- its 2.5D package -- to NVIDIA. Other companies will ...

TSMC’s (Taiwan Semiconductor) 2.5D advanced packaging CoWoS (Chip on wafer and wafer on substrate) technology is currently the primary technology used for AI chips. The production capacity of CoWoS ...

For years, the semiconductor industry's great anxiety was silicon: whether foundries could shrink transistors fast enough, manufacture wafers in sufficient volume, and keep pace with the exponential ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out a test chip with an 8.6Gbps HBM3 Controller and PHY and GLink 2.3LL for AI/HPC/xPU/Networking ...

Multi-protocol subsystem IP provides 8 Tbps/mm bandwidth density with D2D data rate of 24 Gbps for hyperscaler, high performance computing (HPC) and AI applications LONDON & TORONTO--(BUSINESS ...

Taiwan Semiconductor Manufacturing Company added $100 billion to its Arizona commitment Thursday, raising its total US pledge to $265 billion across 12 facilities — the largest direct investment from ...

As the benefits of Moore's law reach their limits, advances in chip performance turn to the back end of production. Back-end semiconductor processing is booming due to limits in front-end innovation.

Apple is expected to use TSMC's new 2nm process and SoIC-X (System on Integrated Chip) advanced packaging technology in the second half of 2025, according to new reports. AMD was the first to adopt ...

Although Samsung has been the subject of market rumors regarding Nvidia's placement of its 2.5D packaging orders, industry sources recently said there is no information regarding the timetable for ...