While researching copper plating graphite for a project, [Dave] stumbled upon a blog post illustrating a brilliant approach to metal plating 3D printed parts. Our pioneers in this new technique are ...
TOKYO, JAPAN: ADEKA Corp. has developed a new single-component type additive for TSV (Through Silicone Via) copper plating that will bring a reduction in costs, prevent defects and is very versatile.
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