Spansion Inc. and United Microelectronics Corporation announced the joint development of a 40nm process that integrates UMC’s 40nm LP logic process with Spansion® proprietary embedded Charge Trap (eCT ...
ASML, TSMC and imec have reported progress in scaling two-dimensional (2D) material transistors, announcing the first ...
Two-dimensional (2D) semiconductors have potential applications from mainstream logic and analog circuits to flexible electronics 1,2,3,4,5,6,7,8. Semiconductive transition-metal dichalcogenides (TMDs ...
New integration and patterning schemes used in 3D memory and logic devices have created manufacturing and yield challenges. Industrial focus has shifted from the scaling of predictable unit processes ...
With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...
MEMS are primarily transducer systems that can control or sense chemical, optical, or physical quantities, such as fluids, acceleration, or radiation. A MEMS device/transducer possesses an electrical ...
Pharma 4.0 integrates LIMS, AI algorithms, and digital twin technology to eliminate data silos and drive connected ...
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