The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools ...

Dicing tapes are fundamentally designed to hold the semiconductor wafer during the process. This procedure separates the dies and furthermore keeps the chips inside close resistances regarding ...

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...