Track 14 at this year’s DesignCon conference is “Ensure Signal Integrity with RF/Microwave/EM Analysis Techniques” and covers signal integrity analysis techniques for interconnects and passive ...
CHESTNUT RIDGE, N.Y., Jan. 20, 2020 /PRNewswire/ -- Teledyne LeCroy, a worldwide leader in electronic test and measurement solutions and a business unit of Teledyne Technologies Incorporated, ...
An S-parameter measurement tool permits differential S-parameter measurements based on time-domain reflection and transmission (TDR/T) data. The tool is available as a standalone product or bundled ...
S parameters play a dominant role in high speed PCB simulation and verification. Generation of S parameters is relatively easy at high frequency in comparison to other parameters like Y and Z. In this ...
As a signal travels across a network, it focuses only on what it sees in its path. And increases in data rates over the past few decades have made this path a bit more clouded. System infrastructure ...
As every engineer learns at an early stage, clock edges must be obeyed. In the digital domain, synchronization through global and local clock trees, slew rate and rising/falling times all combine to ...
To achieve gains in power, performance, area, and cost, 3D-IC architectures are pushing electronics design to new limits. Silicon integration technology and associated devices have undergone an ...
In a nutshell, Artificial Intelligence (AI) and its growing list of applications demand a considerably large amount of bandwidth to push bits in and out of memory at the highest speeds possible. AI ...
Signal integrity (SI) and power integrity (PI) are two distinct but related realms of analysis concerned with proper operation of digital circuits. In signal integrity, the main concern is making sure ...
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