South Korean company SK Hynix had a groundbreaking ceremony Aug. 27, 2026, for a more than $4 billion semiconductor packaging and research facility at Purdue University Research Park. The site is set ...

A major investment in Indiana’s growing semiconductor industry took another step forward Thursday as SK hynix officially broke ground on a ...

SK hynix (NasdaqGS:SKHY) has broken ground on a US$4b high bandwidth memory packaging facility in Indiana, creating its first advanced memory production hub in the United States. The project is ...

By Kenrick Cai and Heekyong Yang WEST LAFAYETTE, Indiana, Aug 27 (Reuters) - South Korean chipmaker SK Hynix on Thursday held a groundbreaking ceremony for an advanced packaging and research facility ...

Construction has been underway since April on the 133-acre site, but Thursday’s groundbreaking ceremony marked a major milestone as the facility starts to take shape.

At the groundbreaking ceremony for SK Hynix's first U.S. facility, CEO Kwak Noh-Jung says Indiana will be a key memory production base by 2030.

SK hynix on Thursday formally launched its $3.87 billion advanced chip packaging project in Indiana, a facility set to produce the first high bandwidth memory m ...

SK Hynix breaks ground on a $4 billion advanced packaging facility in Indiana to bring domestic HBM manufacturing closer to customers like NVIDIA.

SK hynix builds Indiana HBM hub to supply Nvidia, bolster US-Korea chips Cleanroom slated for 2028 as $4 billion Indiana fab ...

SK hynix announced today that it held a groundbreaking ceremony for an advanced packaging [1] production facility for AI memory on the 27 th (local time) at the Holloway Gymnasium, Purdue University, ...

SK hynix said in an official newsroom statement on September 16, 2026, that no plans have been confirmed or finalized regarding reported talks with Intel about manufacturing memory chips in the United ...