We recently published a list of 13 AI News and Ratings You Probably Missed. In this article, we are going to take a look at where Micron Technology, Inc. (NASDAQ:MU) stands against other AI stocks. As per a CNBC report,

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

It’s Singapore’s first facility dealing with HBM, part of the AI chips that are powering companies like Nvidia and TSMC to new heights.

Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor giant expands its capacity to cater to booming demand for AI chips.

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the company’s current facilities in Singapore. It marks Singapore’s first HBM advanced packaging facility,

Micron invests $7 billion in Singapore's first high-bandwidth memory (HBM) facility to support growing AI demand.

Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) in Singapore. The company will invest $7 billion in the plant, as it expects demand for HBM3E,