Competitive landscape: Sony accounted for close to 50% of global CIS revenue in 2025; China has become the second-largest CIS ...
Imagine launching a groundbreaking smartphone, only to discover that a significant percentage of the devices are faulty, leading to massive recalls, disappointed customers, and financial losses. Or, ...
The global semiconductor industry is experiencing one of the strongest expansion periods in its history, with artificial ...
In sectors ranging from low-power wearables to general purpose MCUs and MPUs, the demand for responsive, visually appealing ...
GlobalFoundries (Nasdaq: GFS)(GF) and RAAAM Memory Technologies, a pioneer in advanced on-chip memory solutions, today announced a strategic collaboration to develop and qualify Gain-Cell RAM (GCRAM) ...
GlobalFoundries is probably doing something right because China has set its eyes on GlobalFoundries with rumors of a possible imminent acquisition. Indeed, thanks to several strategical decisions, ...
Global semiconductor revenue is expected to reach $1.6 trillion in 2026, increasing 92% from 2025 revenue of $809 billion, according to Gartner, Inc., a business and technology insights company. In ...
Keysight Technologies, Inc. today announced that AttoTude Inc. has expanded its use of Keysight EDA software to manage its full IC design workflow. As a result, AttoTude has reduced its design cycles ...
Multi-Project Wafer (MPW) runs are often described as a low-cost way to get first silicon. That’s true — but only if you understand what the MPW fee actually includes and, just as importantly, what it ...
SK hynix has broken ground on a major advanced packaging facility in Indiana as the memory manufacturer expands production capacity to meet rapidly growing demand for High Bandwidth Memory driven by ...
65nm, 28nm, 10nm, 7nm… If you follow Intel’s processors or Xilinx’s FPGAs, you have probably heard about the term semiconductor process node. Semiconductor foundries are investing billions of dollars ...
The Highly Accelerated Stress Test (HAST testing) involves the effects of humidity and temperature on an IC or ASIC. The HAST test is designed to test the package of the ASIC under extreme humidity ...