SE: With all these thermal issues and growing complexity of these multi-die assemblies, are there new kinds of stress testing ...

AI chips and data center communications see big funding; 75 startups raise $2 billion. The first quarter of 2025 saw six ...

More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.

Neuro-synaptic RAM; 3D photonic-electronic data link; complex memory management.

U.S. IC chemicals and materials; China export blacklist expands; global fab equipment report; high-density 3D DRAM; ...

The founders of EDA are retiring, and perhaps it’s time that EDA headed off in a different direction.

Semiconductor verification is changing to integrate AI with human expertise.

A new technical paper titled “Analyzing Modern NVIDIA GPU cores” was published by Universitat Politècnica de Catalunya.

Unveiling GPU Bottlenecks in Large-Batch LLM Inference” was published by researchers at Barcelona Supercomputing Center, ...

A new technical paper titled “Thermal Boundary Resistance Reduction by Interfacial Nanopatterning for GaN-on-Diamond ...

L-R: Cadence’s Young; Synopsys’ Stahl; Siemens’ Munsey; ChipAgents’ Wang; Theodore Wilson. SE: What is a digital twin in the ...

A new technical paper titled “Synaptic and neural behaviours in a standard silicon transistor” was published by researchers ...