By taking up such little space in an electronics system, ASICs make it easier for engineers to design devices as compact and ...

The MIPI Alliance, that develops interface specifications for mobile industries, has released MIPI I3C Basic v12.

For Taiwan, which exports $12bn in chips to the US, this could have been a major blow but for the fact that Trump’s tariff ...

Electronics distributor, Astute Group, has announced a new strategic distribution agreement with Puya Semiconductor.

Data centre operators are aiming for high-voltage changes to their power infrastructure all the way into the rack.

Astroscale to provide Xona Space Systems with next-generation docking plates for integration into its LEO constellation.

Photonics project looks to monitor structural shifts, stress, and vibrations in real time, using laser light pulses.

TSMC already holds a dominant lead at the 3nm node and its shift to the GAAFET architecture at 2nm means that competition at ...

Arm CEO Rene Haas has revealed that the company is stepping up investment in chiplets and solutions development.

Nexperia has introduced a new series of USB Type-C and USB power delivery (USB PD) controller ICs to support up to 18-140 W ...

Airfide Networks has unveiled its next-generation micro-mobility occupancy sensor, the AFN6843, which has been enhanced with Wi-Fi HaLow connectivity. The announcement marks a ‘pivotal step’ forward ...

As data rates for USB4 and Thunderbolt interfaces exceed 10 GHz, ESD protection must deliver superior RF performance while ...