Abstract: In order to scale wafer-to-wafer hybrid bonding to sub-micrometer pitches, a tight control of surface topography after CMP is required. The post CMP Cu pad recess with respect to the bonding ...
Abstract: 3D Multi-stacking technology using Cu-Cu hybrid wafer bonding has been developed to achieve superior power, speed performances and higher density with minimized form factor. To realize multi ...
Chinese researchers have announced a new technique to mass produce 2D material wafers, paving the way for high-performance electronics using a successor to silicon. As semiconductor chips evolve, ...
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