New BZPACK mSiC® Power Modules Are Designed for Demanding Applications in Harsh Environments

The BZPACK mSiC power modules leverage Microchip’s advanced mSiC technology, incorporating performance of its MB and MC SiC ...
CNX Software

ESP32-P4 revision 3.0 gains new power rail, requires new PCB design and firmware

Espressif's ESP32-P4 revision 3.0 and greater converts pin 54 of the chip from NC (non-connected) to a power rail (VDD_HP_1), ...
eCoustics

FiiO DARKSIDE PRO Linear Power Supply Promises Cleaner, Low Noise Power for Desktop Hi-Fi Under $200

Can a $159 linear power supply fix weak wall adapters and unlock better sound from your DAC or amp? FiiO thinks the DARKSIDE ...
Electropages

New power modules designed for demanding applications in harsh environments

Microchip Technology has announced its BZPACK mSiC power modules, designed to meet stringent High Humidity High Voltage High ...
CIE – Components in Electronics

New BZPACK mSiC power modules from Microchip are designed for demanding applications in harsh environments

Microchip Technology has announced its BZPACK mSiC® power modules, designed to meet stringent High Humidity High Voltage High ...
Electronic Design

Rugged High-Side Driver Protects Against Severe Voltage Transients in Auto Apps

ST’s smart automotive-grade high-side driver meets the industry’s stringent quality standard for electrical isolation, insulation, and creepage/clearance.
Elektor Magazine

Build a Mini ESP32 Rocket Drone that Flies 100km/h+ | ESP-BLAST

Inspired by South African and Australian builders pushing record-braking speeds with their larger drones, this little one ...
IEEE

Review and Outlook on GaN and SiC Power Devices: Industrial State-of-the-Art, Applications, and Perspectives

Abstract: We present a comprehensive review and outlook of silicon carbide (SiC) and gallium nitride (GaN) transistors available on the market for current and next-generation power electronics.