In recent years semiconductor research papers prominently featured several key subjects driven by technological advancements and industry demands. Generative AI and high-performance computing (HPC) ...
Tower Semiconductor has used OpenLight Photonics' 200G heterogeneous modulator design IP to demonstrate 400G/lane modulator on Tower’s commercially available, integrated silicon photonics platform, ...
RF and Opto semiconductor device specialist MACOM Announced introduction of high power capable new optical amplifier devices to amplify light signals so that they are powerful enough to travel longer ...
NVIDIA’s GTC 2025 conference kicked off this week, spotlighting the latest advancements in artificial intelligence (AI) and semiconductor technology. From groundbreaking GPU architectures to visionary ...
Cadence has announced launch of AI powered EDA tool-suite Conformal AI Studio to address the Semiconductor chip design industry requirement of higher productivity and quick turnout of complex designs ...
Lam Research announces industry's first Molybdenum deposition tool ALTUS Halo for high-volume chip production overcoming limitations of metals such as Tungsten which has replaced Copper to enable chip ...
Applied Materials announced introduction of world's most advanced new defect review system SEMVision H20 featuring electron beam (eBeam) technology with advanced AI image recognition. This tool can ...
MaxLinear showcases Sierra radio SoC linearization performance as a complete Open RAN Radio Unit (O-RU) solution at MWC 2025. MaxLinear is highlighting the chip enables radio vendors to rapidly and ...
Open Compute Project Foundation (OCP) and JEDEC Solid State Technology Association announce the availability of new Chiplet Design Kits for use with today's EDA tools covering Assembly, Substrate, ...
Sachin Tendulkar invested RRP Electronics has formed strategic alliance with US-based Deca Technologies, where RRP to integrate Deca’s innovative Wafer-Level Chip Scale Packaging (WLCSP) and M-Series ...
If you wish to send any news/press releases or design article related to electronics/semiconductor design to publish in EE Herald, email it to [email protected]. We ...
Teledyne LeCroy has introduced the Summit M64, a PCI Express (PCIe) protocol analyzer/exerciser to their product lineup. This cutting-edge system captures and generates PCIe 6.x, CXL 3.x, and NVMe 2.x ...
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