Vinci announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs.
Abstract: This paper investigates the surge reliability of commercial 1200V SiC MOSFETs through a combined approach of experimental testing and multiphysics simulation, elucidating the failure ...
The Julia DSC provides advanced thermal analysis with patented air cooling, modular design, and intuitive software, enhancing efficiency in any lab environment. In this interview, Jiri Kislinger ...
The true nature of our universe as been an open debate for millennia, and recently, scientists and philosophers have pondered whether it might be a hyper-realistic simulation perpetuated by some super ...
A new technical paper titled “DeepOHeat-v1: Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design” was published by researchers at Intel Corporation, ...
The Army said Friday the 8,000-square-foot research, development and analysis facility on Redstone Arsenal will serve as a central hub for computational and analytical capabilities for USASMDC ...
As a central pillar of modern society, the pharmaceutical industry bears the load of billions of lives around the world. In 2022, the global revenue of the pharmaceutical industry approximated $1.5 ...
Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...
Scientists from Southeast University, Physcience Golden Silicon New Material Technology Co., Ltd. and Contemporary Amperex Technology Co., Ltd. proposed a schematic diagram of potential sources of ...
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