Innovasea shrinks fish-tracking tags to 0.3 g, balancing battery life, size, and reliability for acoustic telemetry research.

Qualcomm’s Chris Lattner says AI agents can optimize kernels but can’t replace software engineering or build dependable chip ...

A*STAR and MetaOptics developed a process to fabricate titanium dioxide (TiO₂) metalenses on 300-mm glass wafers using DUV ...

Discover how physical AI unlocks economic value by balancing advanced machine intelligence with strict SWaP-C engineering ...

Choose timing with confidence: compare crystals, oscillators, RTCs, MEMS, and atomic references for reliable designs—download ...

Applied Materials' $5B EPIC Center aims to accelerate semiconductor R&D, driving market share, AI innovation, and $12B+ ...

The Qualcomm Arm verdict is the latest chapter in a four-year IP dispute between the two chip giants about claims on license ...

This year’s Nobel prizes linked large systems to their smallest parts. What can chip design learn, and can AI help reverse ...

A trillion-dollar industry driven by AI and quantum computing, with Zeiss inspection tech and advanced packaging innovations.

Explore OCP Global Summit 2026 breakthroughs: high-voltage 800 V DC-to-12 V power boards, advanced server PSUs, and isolated ...

AMD's David Wang says talent is key to Taiwan's AI future, alongside advanced packaging, AI PCs, and open standards.